Share Email Print
cover

Proceedings Paper

Pulse reverse copper electrodeposition in trench arrays of damascene geometries: numerical and experimental studies
Author(s): Damien Veyret; Demetrious Papapanayiotou; Maria Georgiadou; R. C. Alkire
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 4181, Challenges in Process Integration and Device Technology, ; doi: 10.1117/12.494577
Show Author Affiliations
Damien Veyret, Institut Univ. des Systemes Thermiques Industriels (France)
Demetrious Papapanayiotou, CuTek Research Inc. (United States)
Maria Georgiadou, Univ. of Illinois/Urbana-Champaign (United States)
R. C. Alkire, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 4181:
Challenges in Process Integration and Device Technology
David Burnett; Shin'ichiro Kimura; Bhanwar Singh, Editor(s)

© SPIE. Terms of Use
Back to Top