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Proceedings Paper

High-density packaging and interconnect of massively parallel image processors
Author(s): John C. Carson; Ronald Indin
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Paper Abstract

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Paper Details

Date Published: 1 November 1991
PDF: 8 pages
Proc. SPIE 1541, Infrared Sensors: Detectors, Electronics, and Signal Processing, (1 November 1991); doi: 10.1117/12.49338
Show Author Affiliations
John C. Carson, Irvine Sensors Corp. (United States)
Ronald Indin, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 1541:
Infrared Sensors: Detectors, Electronics, and Signal Processing
T. S. Jay Jayadev, Editor(s)

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