Share Email Print
cover

Proceedings Paper

Modular MEMS: packaging and interfaces
Author(s): Matthias Schuenemann; Gerd Bauer; Achim Stock; Kourosh Amiri Jam
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, ; doi: 10.1117/12.491582
Show Author Affiliations
Matthias Schuenemann, Fraunhofer-Institut fuer Produktionstechnik und Automatisierung (Australia)
Gerd Bauer, Fraunhofer-Institut fuer Produktionstechnik und Automatisierung (Germany)
Achim Stock, Fraunhofer-Institut fuer Produktionstechnik und Automatisierung (Germany)
Kourosh Amiri Jam, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 4593:
Design, Characterization, and Packaging for MEMS and Microelectronics II
Paul D. Franzon; Ajay P. Malshe; Francis E.H. Tay, Editor(s)

© SPIE. Terms of Use
Back to Top