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Proceedings Paper

New copper seed layer enhancement process metrology for dual-damascene interconnects: ion chromatography method
Author(s): Shih-Wei Lee; Sergey D. Lopatin; Frank G. Shi
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Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, ; doi: 10.1117/12.490501
Show Author Affiliations
Shih-Wei Lee, Univ. of California/Irvine (United States)
Sergey D. Lopatin, Advanced Micro Devices, Inc. (United States)
Frank G. Shi, Univ. of California/Irvine (United States)


Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Kenneth W. Tobin; Alexander Starikov, Editor(s)

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