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Proceedings Paper

Variability in thickness measurements using x-ray fluorescence technique
Author(s): Inmaculada C. Baltazar; Manolo G. Mena
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Paper Abstract

Thirty units of tin plated Dual In-line Packages were used to evaluate the measurement system for tin thickness using the X-ray Fluorescence technique. The results showed that the system is sensitive to inspector technique and the total measurement error estimate was about 22 microinches. This system for obtaining tin thickness measurements had been recommended only when the variability of the process is at least 80 microinches. Otherwise a more sensitive method must be used.

Paper Details

Date Published: 1 March 1991
PDF: 11 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48959
Show Author Affiliations
Inmaculada C. Baltazar, Intel Philippines Manufacturing Co. (Philippines)
Manolo G. Mena, Intel Philippines Manufacturing Co. (Philippines)

Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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