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Proceedings Paper

Real-time, in-situ measurement of film thickness and uniformity during plasma ashing of photoresist
Author(s): John T. Davies; Thomas E. Metz; Richard N. Savage; Horace O. Simmons
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Paper Details

Date Published: 1 March 1991
PDF: 4 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48948
Show Author Affiliations
John T. Davies, Branson International Plasma Corp. (United States)
Thomas E. Metz, Branson International Plasma Corp. (United States)
Richard N. Savage, SC Technology (United States)
Horace O. Simmons, SC Technology (United States)


Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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