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Proceedings Paper

Business, manufacturing, and system integration issues in cluster tool process control
Author(s): David Richardson
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Paper Abstract

An intensified business environment with acce''erated pace of technoLogy development within the semiconductor industry can lead companies to consider emerging techniques in cluster tooling and Computer Integrated Manufacturing (CIM) systems applications. A logical model of interfaces that exist within a corporate manufacturing environment yields a control hierarchy that is present from the tool up through the corporate computing entity. With these various levels of computer control there is a clearly identified need for consistent information management functions throughout this logical hierarchy. One of the complexities of existing CIM systems is the lack of a coherent data model that transcends all levels of the hierarchy. The creation of coherent information (derived from data collection) requires this consistent management of data and the cluster tool or any other semiconductor manufacturing equipment for that matter becomes a vital link in the information chain. In fact the equipment level of the control hierarchy is the majority source of data required to successfully meet the manufacturing and business needs of the corporation. An example will be developed in this paper of using a cluster tool as a highly integrated mini-fab environment to demonstrate the desirable CIM system concepts. This mini-fab characteristic of cluster tools and other highly integrated manufacturing cell configurations will be used to investigate the CIM system impacts on this class of manufacturing capability. The investigation will look at the host-to-equipment relationship in a

Paper Details

Date Published: 1 March 1991
PDF: 13 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48925
Show Author Affiliations
David Richardson, SEMATECH (United States)

Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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