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Proceedings Paper

Magnetically enhanced reactive ion etching of submicron silicon trenches
Author(s): Kent Cooper; Bich-Yen Nguyen; Jung-Hui Lin; Bernard J. Roman; Phil J. Tobin; Wayne Ray
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Paper Details

Date Published: 1 March 1991
PDF: 12 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48920
Show Author Affiliations
Kent Cooper, Motorola, Inc. (United States)
Bich-Yen Nguyen, Motorola, Inc. (United States)
Jung-Hui Lin, Motorola, Inc. (United States)
Bernard J. Roman, Motorola, Inc. (United States)
Phil J. Tobin, Motorola, Inc. (United States)
Wayne Ray, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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