Share Email Print
cover

Proceedings Paper

Enhanced process control of submicron contact definition
Author(s): Wayne H. Ostrout; Sean Hunkler; Steven D. Ward
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The aggressive drive to reduce device geometries to submicron levels while utilizing ULSI design capabilities has posed many challenges to traditional semiconductor process technology. Among the most critical is the ability to maintain satisfactory contact between two levels of metal through contact holes significantly smaller than the actual design rule itself. Traditional technologies for greater than one micron design rules are not capable of maintaining the consistent output necessary to achieve and maintain Six Sigma process control. Isotropic plasma etching of doped and undoped oxides has been studied as an alternative to the " wet" isotropic etch in the traditional " wet-dry" contact hole etch process scheme. The isotropic etch was characterized using Taguchi and Response Surface Methodology (RSM) multilevel statistical experimental designs. Optimized conditions resulted in process capability of greater than 2. 0 Cpk control measured in reference to critical dimension performance and electrical data analysis.

Paper Details

Date Published: 1 March 1991
PDF: 14 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48910
Show Author Affiliations
Wayne H. Ostrout, Motorola, Inc. (United States)
Sean Hunkler, Motorola, Inc. (United States)
Steven D. Ward, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

© SPIE. Terms of Use
Back to Top