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Proceedings Paper

Evaluation of low-pressure silicon dry-etch processes with regard to low-substrate degradation
Author(s): Manfred Engelhardt
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Paper Details

Date Published: 1 March 1991
PDF: 9 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48900
Show Author Affiliations
Manfred Engelhardt, Siemens AG (Germany)

Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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