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Proceedings Paper

Calibration strategies for overlay and registration metrology
Author(s): Richard M. Silver; Michael T. Stocker; Ravikiran Attota; Michael Bishop; Jau-Shi Jay Jun; Egon Marx; Mark P. Davidson; Robert D. Larrabee
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Paper Abstract

Critical dimensions in current and next generation devices are driving the need for tighter overlay registration tolerances and improved overlay metrology tool accuracy and repeatability. Tool matching, performance evaluation, and a move towards closed-loop image placement control all place an increase on the importance of improved accuracy and calibration methodology. In response to these industry needs, the National Institute of Standards and Technology (NIST) is introducing a calibrated overlay wafer standard. There are, however, a number of calibration requirements, which must be addressed when using these standards. These include identification of the best methods for evaluating uncertainties when using traceable, calibration artifacts, proper data acquisition and analysis, and the best calibration strategy.

Paper Details

Date Published: 2 June 2003
PDF: 18 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.488486
Show Author Affiliations
Richard M. Silver, National Institute of Standards and Technology (United States)
Michael T. Stocker, National Institute of Standards and Technology (United States)
Ravikiran Attota, National Institute of Standards and Technology (United States)
Michael Bishop, International SEMATECH (United States)
Jau-Shi Jay Jun, National Institute of Standards and Technology (United States)
Egon Marx, National Institute of Standards and Technology (United States)
Mark P. Davidson, Spectel Research Corp. (United States)
Robert D. Larrabee, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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