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Proceedings Paper

Packaging considerations of fiber-optic laser sources
Author(s): Veli Heikkinen; Kari Tukkiniemi; Jouko Vaehaekangas; Tapio Hannula
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Paper Abstract

The continuous progress in material and component technology has generated new laser-based applications that require special packaging techniques. Hybrid integration offers a flexible method to accomplish custom design needs. This paper discusses several aspects in fiber optic packaging including optical, thermal, and mechanical issues. Special emphasis is on optical coupling between a laser diode and a single-mode fiber.

Paper Details

Date Published: 1 December 1991
PDF: 7 pages
Proc. SPIE 1533, Optomechanics and Dimensional Stability, (1 December 1991); doi: 10.1117/12.48847
Show Author Affiliations
Veli Heikkinen, Technical Research Ctr. of Finland (Finland)
Kari Tukkiniemi, Technical Research Ctr. of Finland (Finland)
Jouko Vaehaekangas, Technical Research Ctr. of Finland (Finland)
Tapio Hannula, Technical Research Ctr. of Finland (Finland)


Published in SPIE Proceedings Vol. 1533:
Optomechanics and Dimensional Stability
Roger A. Paquin; Daniel Vukobratovich, Editor(s)

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