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Proceedings Paper

State of the art in large-format IR FPA development at CMC Electronics, Cincinnati
Author(s): Mark E. Greiner; Mike Davis; John W. Devitt; Rich Rawe; David R. Wade; Jeff Voelker
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Paper Abstract

Last year, CMC reported performance data on the first article large format Indium Antimonide (InSb) Focal Plane Arrays (FPAs) produced at CMC Electronics Cincinnati (CMCEC). CMCEC's FPA design contains novel, thermally matched elements, which allow scaling from 256 x 256 pixel FPAs up to and including 1Kx1K and 2Kx2K FPAs as shown in Figure 1. Since a common process and wafer size is used to fabricate 256 x 256 640 x 512, 1Kx1K and 2Kx2K FPAs, the main issue in providing 2Kx2K FPAs is one of yeild improvement, not invention. Approximately 30 of these large format 1Kx1K and 2Kx2K FPAs have been built and 18 have been integrated into deliverable systems over the last year.

Paper Details

Date Published: 10 October 2003
PDF: 12 pages
Proc. SPIE 5074, Infrared Technology and Applications XXIX, (10 October 2003); doi: 10.1117/12.487644
Show Author Affiliations
Mark E. Greiner, CMC Electronics Cincinnati (United States)
Mike Davis, CMC Electronics Cincinnati (United States)
John W. Devitt, CMC Electronics Cincinnati (United States)
Rich Rawe, CMC Electronics Cincinnati (United States)
David R. Wade, CMC Electronics Cincinnati (United States)
Jeff Voelker, CMC Electronics Cincinnati (United States)


Published in SPIE Proceedings Vol. 5074:
Infrared Technology and Applications XXIX
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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