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Proceedings Paper

Uncooled focal plane array detector development at InfraredVision Technology Corp.
Author(s): Kenneth A. Hay; Dale Van Deusen; Tina Y. Liu; William A. Kleinhans
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Paper Abstract

InfraredVision Technology Corporation (“ITC”) has developed a low-cost Uncooled Focal Plane Array (“UFPA”) for commercial applications. The ITC-1000 series detector module has been targeted for both imaging and radiometric camera applications. The 320x240 VOx microbolometer-based sensor exploits a 37.5-μm pixel structure to provide potential cost reduction for the camera manufacturers. The CMOS Readout Integrated Circuit (“ROIC”) design offers on-chip nonuniformity correction capability and gain control. As an additional feature, the design allows non-temperature stabilized operation. The integration time can be varied for applications where large variations in infrared radiation must be accommodated. Vacuum packaging of the sensors is accomplished using low-cost metal design. A radiometric version of this detector, the ITC-1100, has also been developed for thermographic applications.

Paper Details

Date Published: 10 October 2003
PDF: 9 pages
Proc. SPIE 5074, Infrared Technology and Applications XXIX, (10 October 2003); doi: 10.1117/12.487455
Show Author Affiliations
Kenneth A. Hay, InfraredVision Technology Corp. (United States)
Dale Van Deusen, InfraredVision Technology Corp. (United States)
Tina Y. Liu, Valley Oak Semiconductor, Inc. (United States)
William A. Kleinhans, Valley Oak Semiconductor, Inc. (United States)


Published in SPIE Proceedings Vol. 5074:
Infrared Technology and Applications XXIX
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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