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Proceedings Paper

True 3D volumetric patterning of photostructurable glass using UV laser irradiation and variable exposure processing: fabrication of meso-scale devices
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Paper Abstract

Meso-scale devices that contain micro-scale features have been fabricated in a photosensitive glass ceramic material using a novel combination of direct-write pulsed UV laser irradiation and variable exposure processing. This merged nonthermal, direct-write laser processing technique involves the precise variation of the laser irradiance during material patterning. The controlled variation of the laser exposure dose is used to selectively alter the chemical etch rate of the processed regions in the glass ceramic. Consequently, variegated and proximal high and low aspect ratio structures can be fabricated on a common substrate. The microstructures can be created in a single, simultaneous chemical batch etch without the need for a complex masking sequence or ablation. For example, adjacent microstructures with aspect ratios of 2:1 and 20:1 have been laser patterned via variable exposure processing and concurrently fabricated on a shared glass wafer following a single chemical etch step. Our current variable exposure technique enables the conversion of CAD patterns and corresponding laser irradiance information into realized microfabricated structures in glass or ceramic form that retain feature sizes within 10% of the desired dimensions. We have applied this technique to fabricate various structures that may be useful in far-infrared (IR) or terahertz (THz) devices that require high aspect ratio features.

Paper Details

Date Published: 19 February 2003
PDF: 7 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486588
Show Author Affiliations
Frank E. Livingston, The Aerospace Corp. (United States)
Henry Helvajian, The Aerospace Corp. (United States)


Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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