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Proceedings Paper

Surface-activated bonding for copper plate by excimer laser irradiation
Author(s): Takashi Suzuki; Takao Araki; Minoru Nishida
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Paper Abstract

When a pair of clean solid surface are brought close to the atoms distance in the vacuum, the solids were bonded by the gravitation and binding force. Such a way of bonding is called a surface activated bonding. In this work, a laser irradiated to a couple of copper plates surface under various conditions of laser irradiation. The surface oxidation layer and organic layer were removed by laser ablation. After the irradiation, a couple of copper plates surface get close to each other. The possibility of the bonding was examined by AFM.

Paper Details

Date Published: 19 February 2003
PDF: 5 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486585
Show Author Affiliations
Takashi Suzuki, Ehime Univ. (Japan)
Takao Araki, Ehime Univ. (Japan)
Minoru Nishida, Ehime Univ. (Japan)


Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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