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Proceedings Paper

Microdrilling of PCB substrate using DPSS 3rd harmonic laser
Author(s): J. G. Kim; Won Seok Chang; Kyung Ku Yoon; Sungho Jeong; Bo Sung Shin; Kyung Hyun Whang
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Paper Abstract

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of through and blind hope in Cu/PI/Cu substrate with the UV DPSSL and a scanning device is investigated by both experimental and numerical methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the multi path for through hole with high energy density and we use Archimedes spiral path for blind hole with different energy densities to ablate different material. Furthermore, Matlab simulations considering the energy threshold of material is performed to anticipate the ablation shape according to the duplication of pulse, and FEM thermal analysis is used to predict the ablation depth of copper. This study would be widely applicable to various laser micromachining applications including through and blind hole micro-drilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzles amongst others.

Paper Details

Date Published: 19 February 2003
PDF: 5 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486559
Show Author Affiliations
J. G. Kim, Korea Institute of Machinery and Materials (South Korea)
Won Seok Chang, Korea Institute of Machinery and Materials (South Korea)
Kyung Ku Yoon, Korea Institute of Machinery and Materials (South Korea)
Sungho Jeong, Kwangju Institute of Science and Technology (South Korea)
Bo Sung Shin, Korea Institute of Machinery and Materials (South Korea)
Kyung Hyun Whang, Korea Institute of Machinery and Materials (South Korea)


Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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