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Proceedings Paper

Laser ablation for MEMS microfabrication on Si and Kapton substrates
Author(s): B. Lan; Ming Hui Hong; Kaidong D. Ye; Shi Xin Chen; Tow Chong Chong
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Paper Abstract

Laser-ablation-based microfabrication technology is applied to fabricate micro-electro-mechanical-systems (MEMS) devices on polymer substrates. A micromachining apparatus is designed and developed which includes a 355 nm laser, an uncoated focusing lens, computer-controlled precision x-y-z stages and in-situ process monitoring systems. Concentric rings microstructures are formed by efficiently changing the laser intensity distribution. Tiny via holes and micro-nozzles with different diameters have been obtained by low power laser direct drilling. Optical microscopy and scanning electron microscopy (SEM) are used to evaluate the processing results at different laser processing parameters. This method has the advantages of low-cost and time-saving in circle via holes fabrications. Potential applications of this novel MEMS fabrication technique are also briefed.

Paper Details

Date Published: 19 February 2003
PDF: 5 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486521
Show Author Affiliations
B. Lan, Data Storage Institute/National Univ. of Singapore (Singapore)
Ming Hui Hong, Data Storage Institute/National Univ. of Singapore (Singapore)
Kaidong D. Ye, Data Storage Institute/National Univ. of Singapore (Singapore)
Shi Xin Chen, Data Storage Institute/National Univ. of Singapore (Singapore)
Tow Chong Chong, Data Storage Institute/National Univ. of Singapore (Singapore)


Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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