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Proceedings Paper

Desirable wafer edge flatness for CD control in photolithography
Author(s): Tadahito Fujisawa; Soichi Inoue; Tsuneyuki Hagiwara; Kodama Kennichi; Makoto Kobayashi; Katsuya Okumura
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Paper Abstract

Desirable wafer edge flatness was investigated to obtain optimum free-standing wafer edge shape for photolithography. In order to obtain the criteria of free-standing edge shape, we clarified the desirable post-chuck flatness at edge sites in advance. We investigated a desirable free-standing wafer edge, taking into consideration both the wafer and wafer holder shape. Firstly, to obtain a desirable post-chuck wafer edge shape, the vicinity of wafer edge after chucking was modeled, and SFQR was simulated. Secondly, a shape in the vicinity of free-standing edge shape was modeled, and the edge flatness after chucking was simulated. And finally, the simulated flatness was compared with the desirable post-chucked wafer edge shape, and we could obtain desirable free-standing wafer edge shape. Individual measurement of the free-standing back-side and front-side surfaces as well as the thickness of the edge position was found to be necessary for accurate estimation of the post-chuck edge shape.

Paper Details

Date Published: 26 June 2003
PDF: 10 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.485522
Show Author Affiliations
Tadahito Fujisawa, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)
Tsuneyuki Hagiwara, Nikon Corp. (Japan)
Kodama Kennichi, Nikon Corp. (Japan)
Makoto Kobayashi, Shin-Etsu Handotai Co. Ltd. (Japan)
Katsuya Okumura, The Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)

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