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Proceedings Paper

Resolution enhancement technology requirements for 65-nm node
Author(s): Armen Kroyan; Hua-Yu Liu
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Paper Abstract

In this paper, we evaluate various strong and weak resolution enhancement techniques in the context of 65nm technology node requirements. Specifically, we concentrate on a simulation-based performance comparison of the dark-field alternating aperture and chrome-less shifter-shutter phase shifting masks (AAPSM and CLM respectively) for imaging of the critical gate level. Along with the through-pitch aerial image quality, the mask error enhancement factor, proximity effects, and the overall process latitudes are compared. Results show that while there might be multiple approaches in 193nm lithography to pattern isolated and semi-isolated pitches, it is necessary to utilize strong resolution enhancement in order to resovle dense pitches and achieve a sufficient common process performance with required CD control for the 65nm node.

Paper Details

Date Published: 10 July 2003
PDF: 9 pages
Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); doi: 10.1117/12.485486
Show Author Affiliations
Armen Kroyan, Numerical Technologies, Inc. (United States)
Hua-Yu Liu, Numerical Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 5042:
Design and Process Integration for Microelectronic Manufacturing
Alexander Starikov, Editor(s)

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