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Proceedings Paper

Simulation of imaging and stray light effects in immersion lithography
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Paper Abstract

Immersion lithography is a viable method for continuing the reduction in critical dimension. Much of the improvement in image quality in immersion lithography centers around high-NA vector imaging effects and in particular the roles of the resist coupling and polarization properties. Electromagnetic scattering from local inhomogenities is considered yet emphasis is placed on the importance of accounting for high-NA, vector, immersion and resist standing wave effects. A new vector TCC formulation is introduced in SPLAT 6.0. The formulation is tested against a new theoretical formula for the Strehl ratio in air at high-NA and imaging 2D contact patterns at high NA in the resist stack.

Paper Details

Date Published: 26 June 2003
PDF: 13 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.485460
Show Author Affiliations
Scott Hafeman, Univ. of California/Berkeley (United States)
Andrew R. Neureuther, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)

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