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Proceedings Paper

Photoblanks for advanced lithography based on Corning high-purity fused silica (HPFS)
Author(s): Robin M. Walton
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Paper Abstract

Photomask specifications for advanced KrF and ArF lithography tools require improvements in both glass substrate quality and coating development. CD control and uniformity will be driven by transmission, index and birefringence uniformity of the substrate. Coating development will facilitate the use of advanced resolution enhancement techniques. Progress in the development of Corning’s HPFS blanks for advanced lithography applications is reviewed. A variety of new masking materials are being developed to complement HPFS including specialized absorber coatings with low reflectivity and phase shift coatings to enable attenuated phase-shift photomasks. The optical properties of these materials will be described.

Paper Details

Date Published: 26 June 2003
PDF: 5 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.485404
Show Author Affiliations
Robin M. Walton, Corning Inc. (United States)


Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)

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