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Proceedings Paper

Lithographic tradeoffs between different assist feature OPC design strategies
Author(s): James C. Word; Siuhua Zhu
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Paper Abstract

In recent years many of the problems associated with the use of assist features have been partially or completely resolved. Such issues include mask manufacturing and inspection, software maturity, and the so-called forbidden pitch problem. Still, the lithographer is faced with numerous choices in developing production worthy assist feature designs. This paper will examine some of the choices, and the tradeoffs associated with each. In particular the choice between simple 1D scatter bar designs and various 2D designs will be explored to determine the tradeoffs with lithographic performance. A DRC (Design Rule Check)-driven technique has been developed to highlight potential shortcomings of each individual design strategy. The lithographic impact of these shortcomings has been confirmed with on-Silicon process data.

Paper Details

Date Published: 10 July 2003
PDF: 12 pages
Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); doi: 10.1117/12.485326
Show Author Affiliations
James C. Word, Integrated Device Technology, Inc. (United States)
Siuhua Zhu, Integrated Device Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 5042:
Design and Process Integration for Microelectronic Manufacturing
Alexander Starikov, Editor(s)

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