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Proceedings Paper

Technology CAD for integrated circuit fabrication technology development and technology transfer
Author(s): Samar Saha
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Paper Abstract

In this paper systematic simulation-based methodologies for integrated circuit (IC) manufacturing technology development and technology transfer are presented. In technology development, technology computer-aided design (TCAD) tools are used to optimize the device and process parameters to develop a new generation of IC manufacturing technology by reverse engineering from the target product specifications. While in technology transfer to manufacturing co-location, TCAD is used for process centering with respect to high-volume manufacturing equipment of the target manufacturing equipment of the target manufacturing facility. A quantitative model is developed to demonstrate the potential benefits of the simulation-based methodology in reducing the cycle time and cost of typical technology development and technology transfer projects over the traditional practices. The strategy for predictive simulation to improve the effectiveness of a TCAD-based project, is also discussed.

Paper Details

Date Published: 10 July 2003
PDF: 12 pages
Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); doi: 10.1117/12.485267
Show Author Affiliations
Samar Saha, Silicon Storage Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 5042:
Design and Process Integration for Microelectronic Manufacturing
Alexander Starikov, Editor(s)

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