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Proceedings Paper

Statistical data assessment for optimization of data preparation and manufacturing
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Paper Abstract

Progressing integration and system-on-chip approaches increase the complexity of advznce designs. Data preparation, mask and wafer manufacturing have to cope with these designs while achieving high throughput and tight specifications. One of the biggest variables in a production mask processing flow is the actual design being produced. Layout variability can invalidate process settings by introducing conditions outside of the range the process is calibrated for. Characterization of how parameters such as density distributions, CD distributions, minimium, and maximum CD impact yield will no doubt remain proprietary. However, the ability to characterize a layout by these geometric parameters as well as lithographic parameters is a common need. Gathering this knowledge prior to the processing can contribute significantly to the efficiency of applying process recipes once the correlation has been made. The capabilities of a statistical layout analysis are demonstrated and practical applications in mask data preparation and manufacturing are discussed.

Paper Details

Date Published: 10 July 2003
PDF: 7 pages
Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); doi: 10.1117/12.485262
Show Author Affiliations
Steffen F. Schulze, Mentor Graphics Corp. (United States)
Patrick LaCour, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 5042:
Design and Process Integration for Microelectronic Manufacturing
Alexander Starikov, Editor(s)

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