Share Email Print
cover

Proceedings Paper

Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab
Author(s): Pey-Yuan Lee; Chi-Shen Lo; Yi-Hung Chen; Thomas Teng; Steven Fu; Mico Chu; Jason C. Yee
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We will present a complete example that demonstrates daily CD monitor for good CDSEM control, including sampling plan, monitoring procedure, and monitoring and matching data for multiple CDSEM. In addition, we also investigate two methods to address the carbon contamination problem. In the first method, carryover trends on three different film stacks, poly, metal, and multi-layer metal, before and after plasma clean are compared in search of ways to minimize carryover. The second method applies statistical treatment to remove the effect of carryover while maintaining sensitivity over small fluctuations in line CD monitor results. Both linear regression and exponentially weighed moving average calculated from daily monitor data are used to model the baseline carryover trend for the purpose of isolating tru tool variability. Using this method, we can easily quantify the long-term stability of each CDSEM, and with that, we are able to calculate the true long-term process variation Cp by subtracting the CDSEM variation component from the observed total Cp.

Paper Details

Date Published: 15 July 2003
PDF: 12 pages
Proc. SPIE 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing, (15 July 2003); doi: 10.1117/12.485227
Show Author Affiliations
Pey-Yuan Lee, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chi-Shen Lo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Yi-Hung Chen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Thomas Teng, KLA-Tencor Corp. (United States)
Steven Fu, KLA-Tencor Corp. (United States)
Mico Chu, KLA-Tencor Corp. (United States)
Jason C. Yee, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 5041:
Process and Materials Characterization and Diagnostics in IC Manufacturing
Kenneth W. Tobin Jr.; Iraj Emami, Editor(s)

© SPIE. Terms of Use
Back to Top