Share Email Print
cover

Proceedings Paper

Industry survey on nonvisual defect detection
Author(s): Carol A. Boye
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Non-visual defects are anomalies that result in electrical fail at final wafer test but are not detectable in-line with the current optical defect detection tool set. These defects have been found to constitute a major potion of the list of reasons for electrical yield loss. Non-visual defects may be so small they are beyond the resolution of available optical tools, they may have no physical remnant, they may be mechanical or electrical in nature, or they may be due to subtle process variations, or parametric variations. In order to understand the exact nature of the non-visual defect problem, International SEMATECH (ISMT) conducted an industry survey of eight major semiconductor device manufacturers. The 2002 "Non-visual Defect Detection Survey" was designed to determine which specific levels, processes, and defect types are of most concern to semiconductor manufacturers for causing non-visual defects. In this paper, the major observations, issues, and recommendations that resulted from the survey will be presented, as well as directions for future non-visual defect detection based on survey results.

Paper Details

Date Published: 15 July 2003
PDF: 10 pages
Proc. SPIE 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing, (15 July 2003); doi: 10.1117/12.485211
Show Author Affiliations
Carol A. Boye, International SEMATECH (United States)


Published in SPIE Proceedings Vol. 5041:
Process and Materials Characterization and Diagnostics in IC Manufacturing
Kenneth W. Tobin; Iraj Emami, Editor(s)

© SPIE. Terms of Use
Back to Top