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Proceedings Paper

Baking study of fluorinated 157-nm resist
Author(s): Francis M. Houlihan; Raj Sakamuri; Andrew R. Romano; Ralph R. Dammel; Will Conley; Georgia K. Rich; Daniel Miller; Larry F. Rhodes; Joseph M. McDaniels; Chun Chang
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Paper Abstract

A statistical design of experiments for the post-applied bake and post-exposure bake temperatures for two types of resists, the commercial formulation AZ FX 1000P and an experimental resist AZ EXP 20 X, was carried out using contrast, clearing dose and dark erosion as response variables examined. It was found that for AZ FX 1000P dark erosion could be suppressed entirely and contrast improved by employing a lower PEB without significant impact on the contrast. In this manner, a substantial improvement in the image quality for AZ FX 1000P was obtained. AZ EXP 20X was not susceptible to dark erosion at higher post-applied bakes as was AZ FX 1000P. Both resists gave better imaging at lower post-exposure bake temperatures in the range of ~110°C, presumably because of excessive acid diffusion at higher temperatures, such as 150°C. Generally, the contrast achievable with AZ EXP 20 X (>16) is much higher than that possible for AZ FX 1000P (~6).

Paper Details

Date Published: 12 June 2003
PDF: 9 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485196
Show Author Affiliations
Francis M. Houlihan, Clariant Corp. (United States)
Raj Sakamuri, Clariant Corp. (United States)
Andrew R. Romano, Clariant Corp. (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Will Conley, International SEMATECH (United States)
Georgia K. Rich, International SEMATECH (United States)
Daniel Miller, International SEMATECH (United States)
Larry F. Rhodes, Promerus LLC (United States)
Joseph M. McDaniels, Promerus LLC (United States)
Chun Chang, Promerus LLC (United States)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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