Share Email Print

Proceedings Paper

PEB sensitivity studies of ArF resist
Author(s): SangHo Lee; Woo-Kyu Kim; Dalil Rahman; Takanori Kudo; Allen Timko; Clement Anyadiegwu; Douglas S. McKenzie; Takashi Kanda; Ralph R. Dammel; Munirathna Padmanaban
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In an effort to develop a production-worthy 193-resist, it is important to understand the critical factors that impacts the CD variation during a routine photo lithographic process. A comprehensive investigation was done on factors affecting PEB sensitivity in ArF resist system. The areas of interest are polymer components, PAGs, bases, and photo lithographic process. In order to understand effects of the PAGs on PEB sensitivity, a number of PAGs possessing different types of cations and anions were investigated. Sulfonium type cations and acids with longer alkyl chains were found to be effective in reducing the PEB sensitivity. Influence of lithography process conditions was also studied on the PEB sensitivity. Increasing the soft bake (SB) temperature and decreasing the post exposure bake (PEB) temperature reduced the PEB sensitivity but mostly at the expense of line-edge roughness (LER). This paper presents our findings of the critical factors affecting PEB sensitivity and describes improved lithographic results of an optimized experimental formulation. In addition, delay effects after coating, soft bake, exposure, and post exposure bake (PEB) were also investigated and these results are included.

Paper Details

Date Published: 12 June 2003
PDF: 9 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485183
Show Author Affiliations
SangHo Lee, Clariant Corp. (United States)
Woo-Kyu Kim, Clariant Corp. (United States)
Dalil Rahman, Clariant Corp. (United States)
Takanori Kudo, Clariant Corp. (United States)
Allen Timko, Clariant Corp. (United States)
Clement Anyadiegwu, Clariant Corp. (United States)
Douglas S. McKenzie, Clariant Corp. (United States)
Takashi Kanda, Clariant Japan K.K. (Japan)
Ralph R. Dammel, Clariant Corp. (United States)
Munirathna Padmanaban, Clariant Corp. (United States)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

© SPIE. Terms of Use
Back to Top