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Proceedings Paper

Investigation on the role of residual casting solvent in photolithographic behavior in 193-nm resists
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Paper Abstract

We have been interested in the effect of the residual solvent on lithographic performance. The concentration distribution of solvent molecules along the film depth and the amount of residual solvents depend on their physical properties: evaporation rate, boiling point, viscosity, and so on. Since fast-evaporating solvent can make a dense skin-like layer at the top of the resist film, faster evaporation rate of solvent makes thicker film, while slow rate results in thinner film. And the amount of residual solvent is dependent of the evaporation rate of the casting solvent. The amount of residual solvent was verified by TGA method. It was found that the amount of residual solvent is a major parameter to determine film thickness, stiffness of resist pattern, acid diffusion length, and pattern profile shape.

Paper Details

Date Published: 12 June 2003
PDF: 11 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485163
Show Author Affiliations
Jae-Hyun Kang, Dongjin Semichem Co., Ltd. (South Korea)
Seung-Keun Oh, Dongjin Semichem Co., Ltd. (South Korea)
Eun-Kyung Son, Dongjin Semichem Co., Ltd. (South Korea)
Jung-Woo Kim, Dongjin Semichem Co., Ltd. (South Korea)
Yun-Hyi Kim, Dongjin Semichem Co., Ltd. (South Korea)
Yong-Jun Choi, Dongjin Semichem Co., Ltd. (South Korea)
Deog-Bae Kim, Dongjin Semichem Co., Ltd. (South Korea)
Jaehyun Kim, Dongjin Semichem Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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