Share Email Print
cover

Proceedings Paper

Polyelectrolyte effects in model photoresist developer solutions: roles of base concentration and added salts
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We demonstrate that poly(4-hydroxystyrene) and (5, 15, and 20) % tert-butoxycarboxy protected copolymers are polyelectrolytes when dissolved in aqueous base solutions. The polyelectrolyte effect is quantified through the observation of a correlation peak, measured with small-angle neutron scattering. Polyelectrolyte effects are weakened with added salts and excess base. These studies emphasize that salt additives screen the electrostatic interactions, while pH leads to the ionization of the chain. Solvent quality is quantified and the chain configurations are measured in the limit of high ionic strength. It is speculated that the developer-resist interactions will play an important role in development-induced roughness, hence these equilibrium solution measurements can serve a predictive function for future photoresists dissolution models incorporating solvent quality as a parameter.

Paper Details

Date Published: 12 June 2003
PDF: 11 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485147
Show Author Affiliations
Vivek M. Prabhu, National Institute of Standards and Technology (United States)
Ronald L. Jones, National Institute of Standards and Technology (United States)
Eric K. Lin, National Institute of Standards and Technology (United States)
Christopher L. Soles, National Institute of Standards and Technology (United States)
Wen-li Wu, National Institute of Standards and Technology (United States)
Dario L. Goldfarb, IBM Thomas J. Watson Research Ctr. (United States)
Marie Angelopoulos, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

© SPIE. Terms of Use
Back to Top