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Proceedings Paper

Bilayer technology for ArF and F2 lithography: the development of resists to minimize silicon outgassing
Author(s): George G. Barclay; Subbareddy Kanagasabapathy; Gerd Pohlers; Joseph Mattia; Kao Xiong; Sheri L. Ablaza; James F. Cameron; Tony Zampini; Tao Zhang; Shintaro Yamada; Francois Huby; Kenneth Wiley
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Paper Abstract

This paper reports on the development of advanced bilayer resists for ArF and F2 lithography. Contamination of the optics with silicon has been identified as a major issue for the adoption of bilayer technology across all wavelengths. An investigation was carried out to fundamentally understand the effect of the polymer architecture on silicon outgassing. A laser outgassing system was developed and calibrated using model silicon compounds. Model polymers where prepared in which the silicon was incorporated in a number of different ways pendant to the polymer backbone and in the polymer backbone. It was observed that the placement of silicon into the polymer backbone as a poly(silsesquioxane), allows the incorporation of high silicon content for superior etch resistance, with no detectable outgassing of silicon during the exposure step. The design concepts used for these ultra thin silicon imaging systems has resulted in superior imaging capability, resolving sub 100nm dense patterns.

Paper Details

Date Published: 12 June 2003
PDF: 9 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485141
Show Author Affiliations
George G. Barclay, Shipley Co. LLC (United States)
Subbareddy Kanagasabapathy, Shipley Co. LLC (United States)
Gerd Pohlers, Shipley Co. LLC (United States)
Joseph Mattia, Shipley Co. LLC (United States)
Kao Xiong, Shipley Co. LLC (United States)
Sheri L. Ablaza, Shipley Co. LLC (United States)
James F. Cameron, Shipley Co. LLC (United States)
Tony Zampini, Shipley Co. LLC (United States)
Tao Zhang, Shipley Co. LLC (United States)
Shintaro Yamada, Shipley Co. LLC (United States)
Francois Huby, Rohm and Haas Co. (United States)
Kenneth Wiley, Rohm and Haas Co. (United States)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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