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Proceedings Paper

Comparison of ArF bilayer resists for sub-90-nm L/S fabrication
Author(s): Jin Hong; Hyun-Woo Kim; Sung-Ho Lee; Sang-Gyun Woo; Han-Ku Cho; Woo-Sung Han
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Paper Abstract

The advent of 193nm ArF lithography opened new era of sub-90nm patterning in DRAM industry. ArF lithography in single layer scheme, however, has limitation in the substrate fabrication of sub-90nm L/S due to the decreased physical thickness of resist less that 3000Å and soft chemical structure of resist. Bilayer scheme, composed of Si-containing top PR and thick organic bottom layer, is gaining attention for its capability of patterning and control of resist thickness as a substitute for single layer. Several resists were evaluated for bilayer process in terms of photo patterning, dry development, bottom PR durability and SEM shrinkage. Resolution down to 80nm was achieved with Si content in the range of 8-9%. Etch selectivity in the dry development was a strong function of Si content and chemical structure of tope PR with pitch size dependence based on O2/N2 gas chemistry in dual frequency plasma tool. Profile control after dry development was subject to change depending on the gas ration (O2/N2) and power. Resist structure was proved to be a key factor in bottom PR durability at the substrate etch condition. Best combination of top and bottom resists in bilayer scheme will be discussed.

Paper Details

Date Published: 12 June 2003
PDF: 8 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485114
Show Author Affiliations
Jin Hong, Samsung Electronics Co., Ltd. (South Korea)
Hyun-Woo Kim, Samsung Electronics Co., Ltd. (South Korea)
Sung-Ho Lee, Samsung Electronics Co., Ltd. (South Korea)
Sang-Gyun Woo, Samsung Electronics Co., Ltd. (South Korea)
Han-Ku Cho, Samsung Electronics Co., Ltd. (South Korea)
Woo-Sung Han, Samsung Electronics Co., Ltd. (South Korea)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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