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Proceedings Paper

Post soft-bake delay effect on CD variation in DUV resist
Author(s): Shu-Fen Tsai; Chih-You Chen; King-Terk Chan; Hann-Yii Gao; Chin-Yu Ku
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Paper Abstract

In this work, the effect of delayed time after soft-bake process, which is normally called “Post Coat Delay (PCD)” or “Post Soft-bake Delay (PSD)”, on the critical dimension (CD) performance has been investigated for a DUV resist. The smallest contact hole is always found at the first processing wafer, and the contact size gradually returns to its normal CD value when other wafers are continuously running. The resist cross sections showed that the CD variation is caused by resist footing. We have found that the resist footing might come from the reaction between bottom anti-reflective coating (BARC) and hexamethyl disilazane (HMDS).

Paper Details

Date Published: 12 June 2003
PDF: 8 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485092
Show Author Affiliations
Shu-Fen Tsai, Vanguard International Semiconductor Corp. (Taiwan)
Chih-You Chen, Vanguard International Semiconductor Corp. (Taiwan)
King-Terk Chan, Vanguard International Semiconductor Corp. (Taiwan)
Hann-Yii Gao, Vanguard International Semiconductor Corp. (Taiwan)
Chin-Yu Ku, Vanguard International Semiconductor Corp. (Taiwan)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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