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Proceedings Paper

Spectroscopic ellipsometry for lithography front-end level CD control: a complete analysis for production integration
Author(s): David Herisson; DaniEle Neira; Cyril Fernand; Philippe Thony; Daniel Henry; Stephanie Kremer; Marco Polli; Marco Guevremont; Assim Elazami
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Paper Abstract

Using scatterometry based on Spectroscopic Ellipsometry, a complete study of Gate lithography level measurement on standard products has been conducted. Experiments were done on typical ST batches for 120, 90, and 65 nm nodes. KLA-Tencor SpectraCD SE system is used to collect and analyze line critical dimensions and profiles. A systematic correlation with Scanning Electron Microscope (SEM) is done, completed by a cross section analysis. The study also takes into account lithography defect anlysis using a specific targets with intentionally generated process failures. Our objective is to determine the sensitivity window of such measurment technique to process defect and marginal process conditions. We show that KLA-Tencor SpectraCD allows a full reconstruction of the line profile - as well as the film stack underneath it - with values that are in agreement with production control. Cpm values obtained on products demonstrate that SE based scatterometry fulfils all requirements to be integrated in a production envrionemnt and provides suitable metrology for advanced lithography process monitoring.

Paper Details

Date Published: 2 June 2003
PDF: 10 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.485031
Show Author Affiliations
David Herisson, STMicroelectronics Crolles France (France)
DaniEle Neira, STMicroelectronics Crolles France (France)
Cyril Fernand, STMicroelectronics Crolles France (France)
Philippe Thony, CEA Leti (France)
Daniel Henry, STMicroelectronics (France)
Stephanie Kremer, KLA-Tencor Corp. (United States)
Marco Polli, KLA-Tencor Corp. (United States)
Marco Guevremont, KLA-Tencor Corp. (United States)
Assim Elazami, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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