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Proceedings Paper

Rotation-induced measurement error by a CD-SEM
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Paper Abstract

As feature sizes shrink, metrology tools are challenged to deliver higher precision. To meet the demands of the semiconductor industry it is critical to determine and eliminate erros induced by metrology tools. It is also critical to investigate error-inducing factors neglected in the past. Image rotation is regularly experienced on a CD SEM, however error induced by it is assumed to be negligible and neglected. Experience shows an inline SEM often has image rotation of as much as ±26.3% of the edge thickness. For the range of rotation often experienced, experimental data fits the theoretical model suggested. Current tool monitoring techniques rely on pitch accuracy to monitor the day to day performance of the tool. Pitch is also used for tool calibration. However, pitch measurements are not significantly affected by image rotation hence using pitch as a standard for CD SEM monitoring is inadequate when dealing wiht a rotated image.

Paper Details

Date Published: 2 June 2003
PDF: 7 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.485030
Show Author Affiliations
Tejas K. Jhaveri, Rochester Institute of Technology (United States)
Rand Cottle, Photronics Inc. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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