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Proceedings Paper

Advances in Step and Flash imprint lithography
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Paper Abstract

Recent work on Step and Flash Imprint Lithography (SFIL) has been focused on process and materials fundamentals and demonstration of resolution capability. Etch transfer rpocesses have been developed that are capable of transferring imprinted images though 150 nm of residual etch barrier, yielding sub 50 nm lines with aspect ratios greater than 8:1. A model has been developed for the photoinitiated, free radical curing of the acrylate etch barrier materials that have been used in the SFIL process. This model includes the effects of oxygen transport on the kinetics of the reaction and yields a deeper understanding of the importance of oxygen inhibition, and the resulting impact of that process on throughput and defect generation. This understanding has motivated investigation of etch barrier materials such as vinyl ethers that are cured by a cationic mechanism, which does not exhibit these same effects. Initial work on statistical defect analysis has is reported and it does not reveal pathological trends.

Paper Details

Date Published: 16 June 2003
PDF: 6 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.484985
Show Author Affiliations
Stephen C. Johnson, Univ. of Texas at Austin (United States)
Todd C. Bailey, Univ. of Texas at Austin (United States)
Michael D. Dickey, Univ. of Texas at Austin (United States)
Britain J. Smith, Univ. of Texas at Austin (United States)
Eunha K. Kim, Univ. of Texas at Austin (United States)
Andrew Thomas Jamieson, Univ. of Texas at Austin (United States)
Nicholas A. Stacey, Univ. of Texas at Austin (United States)
John G. Ekerdt, Univ. of Texas at Austin (United States)
C. Grant Willson, Univ. of Texas at Austin (United States)
David P. Mancini, Motorola, Inc. (United States)
William J. Dauksher, Motorola, Inc. (United States)
Kevin J. Nordquist, Motorola, Inc. (United States)
Douglas J. Resnick, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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