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Proceedings Paper

In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering
Author(s): Oliver Scholz; Michael Eisenbarth; Randolf Hanke; Thomas Bigl; Peter Schmitt
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Paper Abstract

While solder joints of integrated circuits in BGA and uBGA packages can be tested with 3D-computed tomography, this process is time consuming and too expensive for anything but samples or small production volumes. This paper explores approaches to facilitate a 2D-imaging testing system for BGA and uBGA solder joints. Non-standard pad geometries can be used to cause a deformation of the solder balls during soldering; this deformation is detectable in a 2D-image. By integrating a compact X-Ray-source/detector unit into a reflow soldering station, controlling the quality of the solder joints in real-time during soldering will become possible. This information can then be fed back into the soldering station in order to optimize the soldering process.

Paper Details

Date Published: 22 July 2003
PDF: 10 pages
Proc. SPIE 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems, (22 July 2003); doi: 10.1117/12.484664
Show Author Affiliations
Oliver Scholz, Fraunhofer Institut Integrierte Schaltungen (Germany)
Michael Eisenbarth, Lehrstuhl fur Fertigungsautomatisierung und Produktionssystematik (Germany)
Randolf Hanke, Fraunhofer Institut Integrierte Schaltungen (Germany)
Thomas Bigl, Lehrstuhl fur Fertigungsautomatisierung und Produktionssystematik (Germany)
Peter Schmitt, Fraunhofer Institut Integrierte Schaltungen (Germany)


Published in SPIE Proceedings Vol. 5045:
Testing, Reliability, and Application of Micro- and Nano-Material Systems
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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