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Proceedings Paper

Reactive polymers: a route to nanoimprint lithography at low temperatures
Author(s): Karl Pfeiffer; Freimut Reuther; Patrick Carlberg; Marion Fink; Gabi Gruetzner; Lars Montelius
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Paper Abstract

To utilize the potential of nanoimprint lithography (NIL) you need polymers, which give relief patterns with good thermal and etch resistance, a necessity for subsequent process steps. Thermoplastic polymers with high thermal stability require high imprint temperatures. Such temperatures can cause polymer degradation and problems with pattern transfer due to the different coefficients of thermal expansion of substrate, polymer and stamp. The characteristics and benefits of two types of cross-linking prepolymers with low glass transition temperature (Tg) for nanoimprinting are described. They are soluble in organic solvents and their solutions can be processed like those of poly (methyl methacrylate) (PMMA). The imprinted patterns receive high thermal and mechanical stability through cross-linking polymerization and exhibit high plasma etch resistance. The course of the polymerization was investigated to determine the appropriate conditions for the imprint process. In thermally cross-linking allyl polymers, the cross-linking occurs during imprinting. Process time and temperature depend on the polymerization rate. Volume shrinkage during the polymerization does not adversely affect imprinting. Photochemically cross-linking epoxy-based polymers permit imprint temperatures below 100°C and short imprint times. Tg of the prepolymer determines the imprint temperature. The cross-linking reaction and structural stabilization is performed after imprinting. SEM images demonstrate the realization of the cross-linking polymer approach. Isolated lines down to 50 nm width confirm the successful application of the polymers.

Paper Details

Date Published: 16 June 2003
PDF: 8 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.484442
Show Author Affiliations
Karl Pfeiffer, micro resist technology GmbH (Germany)
Freimut Reuther, micro resist technology GmbH (Germany)
Patrick Carlberg, Lund Univ. (Sweden)
Marion Fink, micro resist technology GmbH (Germany)
Gabi Gruetzner, micro resist technology GmbH (Germany)
Lars Montelius, Lund Univ. (Sweden)


Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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