Share Email Print
cover

Proceedings Paper

Nanometer resolution actuator with multimillimeter range and power-off hold
Author(s): Galen David Powers; Qin Xu; John C. Fasick; James A. Smith
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Photonic assembly packaging, adaptive optics, large optical beam control, and semiconductor test and measurement are application areas that have needs for nanometer-level precision. Utility is increased with features such as greater than 10-millimeter travel, power-off hold, high acceleration and high stiffness. Alignment applications can benefit from a high mechanical power density. This translates into smaller package size for required force, speed, travel and resolution performance. In manufacturing of photonic packages, the space around the work piece often is limited and ergonomic design considerations for workspace are helped with a small profile. Smaller system size implies less total mass and power required for a given performance level, which is highly desirable for airborne or space applications. Smaller mechanical systems benefit from higher stiffness, lower Abbe error, and are less susceptible to environmental transients. A second-generation actuator system that provides about one nanometer open loop step size with 25 millimeters of travel will be characterized. The first-generation model provided more than 100 N force at 25 mm/s speed. The device is compatible to using proprietary thin film and MEMS technology for a high-friction clamping design that simulates an “infinite gear”.

Paper Details

Date Published: 14 August 2003
PDF: 10 pages
Proc. SPIE 5054, Smart Structures and Materials 2003: Industrial and Commercial Applications of Smart Structures Technologies, (14 August 2003); doi: 10.1117/12.483870
Show Author Affiliations
Galen David Powers, EXFO Burleigh Products Group Inc. (United States)
Qin Xu, EXFO Burleigh Products Group Inc. (United States)
John C. Fasick, EXFO Burleigh Products Group Inc. (United States)
James A. Smith, EXFO Burleigh Products Group Inc. (United States)


Published in SPIE Proceedings Vol. 5054:
Smart Structures and Materials 2003: Industrial and Commercial Applications of Smart Structures Technologies
Eric H. Anderson, Editor(s)

© SPIE. Terms of Use
Back to Top