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Proceedings Paper

Debris-free EUV source using a through-hole tin target
Author(s): Yoshifumi Ueno; Tatsuya Aota; Gohta Niimi; Dong-Hoon Lee; Kentaro Nishigori; Hidehiko Yashiro; Toshihisa Tomie
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Paper Abstract

Laser plasma light source using double pulses laser irradiation and through-hole method is proposed as a mass-limited target srouce for extreme UV (EUV) radiation. After minimum necessary material is supplied using the ablation laser from a solid target, only ablated material is irradiated with the heating laser to produce a high-temperature plasma, and EUV radiation is extracted passing through the hole formed in the solid target. Fundamental concept of this scheme, EUV radiation and great reduction of particle debris were experimentally confirmed.

Paper Details

Date Published: 16 June 2003
PDF: 9 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.483746
Show Author Affiliations
Yoshifumi Ueno, Association of Super-Advanced Electronics Technologies (Japan)
Tatsuya Aota, Japan Society for the Promotion of Science (Japan)
Gohta Niimi, National Institute of Advanced Industrial Science and Technology (Japan)
Dong-Hoon Lee, National Institute of Advanced Industrial Science and Technology (Japan)
Kentaro Nishigori, National Institute of Advanced Industrial Science and Technology (Japan)
Hidehiko Yashiro, National Institute of Advanced Industrial Science and Technology (Japan)
Toshihisa Tomie, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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