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Proceedings Paper

Void elimination research in bottom antireflective coatings for dual damascene photolithography
Author(s): Kelly A. Nowak
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Paper Abstract

This paper describes the research completed to qualify materials to be used as bottom anti-reflective coatings (BARCs) for dual damascene (DD) photolithography. Several problems have been identified in the DD process. Among them are low fill, iso-dense bias, meniscus shape, via wall coating, and void formation. The issue focused upon in this research is incomplete displacement or void formation in the vias. These voids will have detrimental effects and could ultimately cause chip failure.

Paper Details

Date Published: 12 June 2003
PDF: 11 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.483737
Show Author Affiliations
Kelly A. Nowak, Brewer Science, Inc. (United States)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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