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Proceedings Paper

Heat-resistant photoresists based on new imaging technique: reaction development patterning (RDP)
Author(s): Takafumi Fukushima; Toshiyuki Oyama; Masao Tomoi
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Paper Abstract

Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer) and polyetherimide (Ultem), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 µm) with about 10-15 µm in thickness.

Paper Details

Date Published: 12 June 2003
PDF: 8 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.483709
Show Author Affiliations
Takafumi Fukushima, Yokohama National Univ. (Japan)
Toshiyuki Oyama, Yokohama National Univ. (Japan)
Masao Tomoi, Yokohama National Univ. (Japan)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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