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Proceedings Paper

The EUV program at ASML: an update
Author(s): Hans Meiling; Vadim Banine; Peter Kuerz; Brian D. Blum; Gert Jan Heerens; Noreen Harned
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Paper Abstract

With the realization of the α-tool, ASML is progressing with the pre-commercialization phase of its EUVL development. We report on the progress in the development of several key modules of the α-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor meets its vacuum requirements, and that both stages after limited servo optimization approach the required scanning performance. A particle detection system has been built for the qualification of the reticle handling module, and preliminary results show that 50nm particles can be detected. The optics lifetime program showed substantial progress by utilizing caplayers to MoSi samples in order to suppress oxidation caused by H2O molecules under EUV illumination: a suppression ≥ 100x is achieved, compared to uncapped MoSi.

Paper Details

Date Published: 16 June 2003
PDF: 12 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.483706
Show Author Affiliations
Hans Meiling, ASML (Netherlands)
Vadim Banine, ASML (Netherlands)
Peter Kuerz, Carl Zeiss (Germany)
Brian D. Blum, ASML (United States)
Gert Jan Heerens, TNO TPD (Netherlands)
Noreen Harned, ASML (United States)


Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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