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Proceedings Paper

Application of scatterometry for CD and profile metrology in 193-nm lithography process development
Author(s): Li-Jui Chen; Chih-Ming Ke; Shinn Sheng Yu; Tsai-Sheng Gau; Pei-Hung Chen; Yao Ching Ku; Burn Jeng Lin; Dan Engelhard; Dave Hetzer; Jason Y.H. Yang; Kelly A. Barry; Lip Yap; Wenge Yang
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Paper Abstract

ArF resist lines are tested using scatterometry to study the CD correlation with CDSEM, profile variation caused by baking temperature and pattern environment, as well as the evaluation of optical proximity effect (OPE). Results show reasonable profiles variation predicted by scatterometry spectra from different baking temperatures. Other good matches are the predicted resist line profiles from dark-field and clear-field pattern environment and various line-pitch ratios. They are found to be very similar with the images from the cross-section SEM. On the other hand, the CD linearity and OPE are also found with good matches between scatterometry CD and SEM CD. However, the maximum pitch size tested for OPE is 0.6 μm. More sparse patterns aer believed to have lower sensitivity caused by the weak characteristics spectrum detected. The spectrum sensitivity is another important topic in this paper. The CD and pitch information is contained across the entire spectrum while small profile variations, like t-top and footing, are predicted in the shorter wavelength region. To predict accurate resist profile for small CD, the usage of the shorter wavelength spectrum is inevitable.

Paper Details

Date Published: 2 June 2003
PDF: 9 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.483692
Show Author Affiliations
Li-Jui Chen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Shinn Sheng Yu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Tsai-Sheng Gau, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Pei-Hung Chen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Yao Ching Ku, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Burn Jeng Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Dan Engelhard, Timbre Technologies, Inc. (United States)
Dave Hetzer, Timbre Technologies, Inc. (United States)
Jason Y.H. Yang, Timbre Technologies, Inc. (United States)
Kelly A. Barry, Timbre Technologies, Inc. (United States)
Lip Yap, Timbre Technologies, Inc. (United States)
Wenge Yang, Timbre Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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