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Proceedings Paper

Three-dimensional measurement by tilting and moving objective lens in CD-SEM
Author(s): Kouji Kimura; Kazuo Abe; Yasuko Tsuruga; Hitoshi Suzuki; Nobuo Kochi; Hirotami Koike; Yuuichiro Yamazaki
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Paper Abstract

There is an increasing necessity for 3D measurement of formed patterns in the semiconductor manufacturing process, and the development of the 3D measurement technology is required even in CD-SEM. In order to obtain 3D images, it is necessary to acquire at least two tilted images from different directions. However, the procedure of tilting the specimen stage is disadvantageous from the throughput point of view. Therefore, we devised the T-MOL system, which enables the acquisition of tilt images without the deterioration of the resolution by tilting the primary electron beam. Moreover, the algorithm of the parallel projection for the 3D reconstruction was developed. Tests proved that new T-MOL electron optical system provides 4nm resolution tilting angle at 5 degrees and that 3D analysis based on T-MOL images is effective.

Paper Details

Date Published: 2 June 2003
PDF: 6 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.483687
Show Author Affiliations
Kouji Kimura, Topcon Corp. (Japan)
Kazuo Abe, Topcon Corp. (Japan)
Yasuko Tsuruga, Topcon Corp. (Japan)
Hitoshi Suzuki, Topcon Corp. (Japan)
Nobuo Kochi, Topcon Corp. (Japan)
Hirotami Koike, Topcon Corp. (Japan)
Yuuichiro Yamazaki, Toshiba Semiconductor Co. (Japan)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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