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Proceedings Paper

Optical digital profilometry applications on contact holes
Author(s): Joerg Bischoff; Xinhui Niu; Nickhil H. Jakatdar
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Paper Abstract

Optical scatterometry and Optical Digital Profiling (ODP) have become mainstram technology in CD and profile metrology. Without question, the extension of these techniques to measure 3D patterns such as contact holes or posts is an important demand. In this paper, we demonstrate the application of ODP to contact holes and posts for both lithography and etch processes. The underlying theory based onthe Rigorous Coupled Wave Approach is outlined and metrology results are compared with simulations.

Paper Details

Date Published: 2 June 2003
PDF: 9 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.483686
Show Author Affiliations
Joerg Bischoff, Timbre Technologies, Inc. (United States)
Xinhui Niu, Timbre Technologies, Inc. (United States)
Nickhil H. Jakatdar, Timbre Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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