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Proceedings Paper

Implementation and benefits of advanced process control for lithography CD and overlay
Author(s): Lena Zavyalova; Chong-Cheng Fu; Gary Stanley Seligman; Perry A. Tapp; Victor Pol
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Paper Abstract

Due to the rapidly reduced imaging process windows and increasingly stingent device overlay requirements, sub-130 nm lithography processes are more severely impacted than ever by systamic fault. Limits on critical dimensions (CD) and overlay capability further challenge the operational effectiveness of a mix-and-match environment using multiple lithography tools, as such mode additionally consumes the available error budgets. Therefore, a focus on advanced process control (APC) methodologies is key to gaining control in the lithographic modules for critical device levels, which in turn translates to accelerated yield learning, achieving time-to-market lead, and ultimately a higher return on investment. This paper describes the implementation and unique challenges of a closed-loop CD and overlay control solution in high voume manufacturing of leading edge devices. A particular emphasis has been placed on developing a flexible APC application capable of managing a wide range of control aspects such as process and tool drifts, single and multiple lot excursions, referential overlay control, 'special lot' handling, advanced model hierarchy, and automatic model seeding. Specific integration cases, including the multiple-reticle complementary phase shift lithography process, are discussed. A continuous improvement in the overlay and CD Cpk performance as well as the rework rate has been observed through the implementation of this system, and the results are studied.

Paper Details

Date Published: 2 June 2003
PDF: 11 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.483665
Show Author Affiliations
Lena Zavyalova, Motorola, Inc. (United States)
Chong-Cheng Fu, Motorola, Inc. (United States)
Gary Stanley Seligman, Motorola, Inc. (United States)
Perry A. Tapp, Motorola, Inc. (United States)
Victor Pol, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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