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Proceedings Paper

An improved method to determine optimal alignment sampling layout
Author(s): Simon Chang; Stephen J. DeMoor; Jay M. Brown; Chris Atkinson; Joshua A. Roberge
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Paper Abstract

As the dimensions of devices shrink and the processing of new devices gets more complex, the requirements for overlay are becoming tighter. Many process elements and previously unmodeled components now dominate the total overlay budget; such as reticle error, alignment-mark quality and design, tool control, alignment system setup and alignment sampling layout, etc. Unmodeled errors (RMSE) consume a larger percentage of the total overlay as the tolerances become tighter. The strategy pursued was to reduce the contribution of each of these elements to as small as possible. In this paper, an improved sampling method is introduced to optimize the sampling layouts in order to minimize RMSE in alignment modeling solutions. The applications of these optimized sampling layouts in both production and system maintenance are also introduced.

Paper Details

Date Published: 2 June 2003
PDF: 11 pages
Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); doi: 10.1117/12.483662
Show Author Affiliations
Simon Chang, Texas Instruments Inc. (United States)
Stephen J. DeMoor, Texas Instruments Inc. (United States)
Jay M. Brown, Nikon Precision Inc. (United States)
Chris Atkinson, Texas Instruments Inc. (United States)
Joshua A. Roberge, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 5038:
Metrology, Inspection, and Process Control for Microlithography XVII
Daniel J. Herr, Editor(s)

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