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Proceedings Paper

Multifunctional piezoelectric stiffness/energy sensor for monitoring the health of structures
Author(s): Kelah Wakha; Majeed A. Majed; Abhijit Dasgupta; Darryll J. Pines
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Paper Abstract

A new mechanical multifunctional dual-stiffness sensor for in-situ real-time stiffness and energy density measurements was developed at the University of Maryland. This sensor is composed of 2 sub-sensors - a stiff and compliant subsensor. The sensor has the ability to predict the elastic field of a given host structure based on the strain state of the two sub-sensors integrated into the structure. This study showed the possibility of using the sensor to deduce the local instantaneous host stiffness and the strain energy density. Because the sensors can be embedded in a structure that is subjected to a complex stress state, Eshelbys equivalent inclusion method was used to derive the elastic properties of the host. An analytical derivation and a sensitivity analysis is given in a paper by Majeed and Dasgupta. Majeed and Dasgupta showed how the stiffness sensor is used to estimate the hosts stiffness. The present study evaluates the use of a dual stiffness sensor using piezoelectric sub-sensors to diagnose damage and to determine the remaining life of structures. The objective of this research is to develop an in-situ health monitoring active sensor for a real structure under its actual lifecycle loading condition. The detection of the onset of any damage, the subsequent monitoring of its growth and the help in predicting the remaining life of the structure constitute the important goals of the system. A numerical verification using finite element analysis (FEA) is presented and the results indicate that the sensor can be used for diagnostics of structures. A distributed array of sensors is used to determine the location of damage. Experimental results are presented for uniaxial experimental tests under monotonic quasistatic loading conditions and indicate that the concept can easily be implemented.

Paper Details

Date Published: 5 August 2003
PDF: 13 pages
Proc. SPIE 5056, Smart Structures and Materials 2003: Smart Structures and Integrated Systems, (5 August 2003); doi: 10.1117/12.483465
Show Author Affiliations
Kelah Wakha, Univ. of Maryland, College Park (United States)
Majeed A. Majed, Univ. of Maryland, College Park (United States)
Abhijit Dasgupta, Univ. of Maryland, College Park (United States)
Darryll J. Pines, Univ. of Maryland, College Park (United States)

Published in SPIE Proceedings Vol. 5056:
Smart Structures and Materials 2003: Smart Structures and Integrated Systems
Amr M. Baz, Editor(s)

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